Doosan Group announced on Friday that it will invest about 550 billion won ($405 million) to expand its copper‑clad laminate (CCL) production line in Changshu, China, to meet growing demand from artificial intelligence (AI) data centers.
The investment will be carried out in stages through 2028, with the new facility slated to begin operations in the second half of that year.
The expansion is part of a broader 970 billion‑won plan announced in September aimed at boosting CCL production capacity for AI infrastructure.
CCL is a key material used in printed circuit boards for AI accelerators, network switches and optical modules in data centers.
The new line will occupy an 185,000‑square‑meter site near Doosan’s existing plant and will build on the company’s current presence in the region.
Officials of Doosan Group and the city of Changshu attended the signing ceremony of an investment agreement held at Suzhou City Hall on 5 November 2026.
The new capacity is expected to start running in the latter half of 2028, as the company ramps up production to keep pace with the surge in AI data‑center construction.
As AI deployments grow worldwide, the demand for high‑performance PCBs and associated materials such as CCL is rising, making this expansion a strategic move for the company and local industry alike.
